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Cooler Master ThermalFusion 400 Thermal Compound (RG-TF4-TGU1-GP)

Cooler Master ThermalFusion 400 Thermal Compound (RG-TF4-TGU1-GP)
Regular price: $10.95
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Availability:Usually ships the same business day
Quantity:
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Product Description

The Cooler Master ThermalFusion 400 Thermal Compound is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.

Features:

  • High Thermal Conductivity
  • Low Thermal Resistance
  • Non-Curing
  • Non-Corrosive
  • Easy Application with Included Razor Blade

    • Specifications:

    Color: Gray
    Specific Gravity: 3.5
    Thermal Conductivity: 2.89 W/m-K
    Volume Resistivity: 2.0E+10 ohm-cm
    Thermal Resistance: 0.032 °C-cm^2/W
    Bond Line Thickness: 0.008 mm
    Volatile content: < 0.1 %
    Net Weight: 4 g