Enzotech's SLF-1 Low Profile Chipset Cooler has a total height of 12mm which reduces the likelihood of interference with other components and provides the best efficiency within a limited space.
Multiple push pin locations for universal mounting on various board assembly. (hole to hole distance 54.6mm and 59m).
Formed of pure copper for enhanced thermal conductivity.
Excellent surface flatness minimizes the interface between the heat source and heatsink.
Specifications:
Dimensions:
37x37x13.5(H) mm
Weight:
51g
Material:
Forged copper 1100
Base Flatness:
Polished mirror surface, 0.0003" to 0.0004"per inch
