Using our unique material forming technology, the SLF1-ULTRA is as powerful as it sounds. By maximizing the surface area, the SLF1-ULTRA has more than twice the amount of pin fins compared to the SLF-1 and produces more than 15% more performance as well. The ultimate source for thermal conductivity.
Features:
Multiple push pin locations for universal mounting on various board assembly. (hole to hole distance: 53mm to 59mm).
Formed of pure copper to enhance thermal conductivity.
Excellent surface flatness minimizes the interface between heat source and heat sink.
Specifications:
Dimension:
37x37x13.5(H) mm
Weight:
47g
Material:
Forged copper 1100
Base Flatness:
Polished mirror surface flatness for machined surfaces are typically in the range of 0.0003" to 0.0004"per inch
