Low Profile - Total height is 13.8mm which reduces the likelihood of interference with other components and provides the best efficiency within a limited space.
Features:
Multiple push pin locations for universal mounting on various board assembly. (hole to hole distance: 59mm to 63mm).
Formed of pure copper to enhance thermal conductivity.
Excellent surface flatness minimizes the interface between heat source and heat sink.
Specifications:
Dimension:
40x40x13.8(H) mm
Weight:
56g
Material:
Forged copper 1100
Base Flatness:
Polished mirror surface flatness for machined surfaces are typically in the range of 0.0003" to 0.0004"per inch
