http://ep.yimg.com/ca/I/yhst-128354961512837_2194_14037091IC Diamond 7 Carat Thermal Compound contains 7 carats of micronized diamonds maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamonds superior thermal conductivity.
Product Description
IC Diamond 7 Carat Thermal Compound - 1.5 gram
IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond’s superior thermal conductivity.
Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond’s are five times better thermal conductors compared to silver which makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
Key Features:
Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 92% by weight, 94% after 10 minute dry-out prior to heat sink installation. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
Superior bulk conductivity
Excellent thermal impedance
Tight particle distributions
< 40 ́ maximum particle diameter
Silicone free
Lower viscosity
Greater stability
Non capacitive or electrically conductive
Application
IC Diamond is composed mostly of diamond powder, and as such is quite thick. Proper application is critical to optimum performance. Squeeze onto the center of the CPU an amount of IC Diamond compound about the size of a pea - the center of the CPU is where most heat is concentrated. Wait 10 minutes to allow solvent to evaporate and then place the heatsink on the CPU and push down to spread IC Diamond over the CPU's surface.
Curing Time
IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use.
Stability
IC Diamond is designed for stability – it will not bleed or separate in normal use.
Key Specifications:
Thermal Conductance:
4.5 W/m-K (data acquired with an ASTM D – 5470 thermal interface test instrument)
